Substrate processing system for processing of a plurality of substrates and method of processing a substrate in an in-line substrate processing system

ABSTRACT

A substrate processing system for processing of a plurality of substrates is described. The system includes a first deposition module being a first in-line module and having a first plurality of vacuum deposition sources; a second deposition module being a second in-line module and having a second plurality of vacuum deposition sources; and a glass handling module between the first deposition module and the second deposition module.

TECHNICAL FIELD

Embodiments of the present disclosure relate to an in-line substrateprocessing system. Further, embodiments of the present disclosure relateto a system and a method to evaporate an OLED layer stack in a verticalorientation, particularly to evaporate a one-colored OLED layer stack,such as a white OLED layer stack, in a vertical orientation. Embodimentsof the present disclosure particularly relate to a substrate processingsystem for processing of a plurality of substrates, such as a substrateprocessing system for processing of a plurality of large area substratesin an essentially vertical orientation, a method of processing asubstrate in an in-line substrate processing system, a vacuumorientation module for a substrate processing system, method oftransporting a large area substrate in a substrate processing system,and method of manufacturing a layer stack of a display on a large areasubstrate.

BACKGROUND

Organic light-emitting diodes (OLED) are a special type oflight-emitting diode in which the emissive layer includes a thin-film ofcertain organic compounds. OLEDs are used in the manufacture oftelevision screens, computer monitors, mobile phones, other hand-helddevices, etc. for displaying information. OLEDs can also be used forgeneral space illumination. The range of colors and brightness possiblewith OLED displays is greater than that of traditional LCD displaysbecause OLED material directly emits light. The energy consumption ofOLED displays is considerably less than that of traditional LCDdisplays.

Further, the fact that OLEDs can be manufactured onto flexiblesubstrates results in further applications. An OLED display may include,for example, layers of organic material situated between two electrodes,for example electrodes from a metallic material. The OLED is typicallyplaced between two glass panels, and the edges of the glass panels aresealed to encapsulate the OLED therein. Alternatively, the OLED can beencapsulated with thin film technology, e.g. with a barrier film.

A process to manufacture OLED displays includes thermal evaporation oforganic materials and deposition of organic materials on a substrate ina high vacuum. It is beneficial to complement this process with the useof a mask in order to block substrate areas from being coated and/or topattern the organic layers onto the substrate during deposition. Herein,the mask is held close to the substrate during deposition of the organiclayers and the substrate is typically arranged behind the mask duringdeposition and aligned relative to the mask.

FIG. 1 describes an exemplary system 10 for generating an organicdisplay that may be used according to an industry standard horizontalin-line processing system. Substrates, such as glass substrates fordisplay industry are processed in a horizontal orientation and enter thesystem 10 in a tab with the site to be processed facing upwards. In aflip chamber 12, the substrates are rotated by 180° to have thesubstrate surface to be processed facing downwardly. A substrate istransferred through a transfer module to one of a plurality of alignmentchambers 16, wherein a mask for masking one or more organic depositionprocesses is provided over the substrate. In an acceleration module 18the horizontally oriented substrates are accelerated to move through theplurality of organic deposition chambers 22, wherein organic layers aredeposited from below the substrate. After the deceleration module 23,the mask is detached in one of a plurality of detachment chambers 26.The masks aligned on the substrate in the alignment chambers 16 anddetached from the substrates in the detachment chambers 26 aretransferred on a mask return path 72, typically under atmosphericconditions. Load lock chambers may be provided at the beginning and theend of the mask return path 72.

The substrate processed with organic layers in the above describedorganic module is transferred in a transfer module 32 to a metallicmodule. The metallic module includes alignment chambers 42, accelerationmodule 44, metal deposition chambers 46, deceleration module 47, anddetachment chambers 49. The substrate handling in the metallic modulecorresponds to the above described organic module. After processing ofthe substrate, the substrate can be rotated by 180° in a second furtherchamber 62 and transferred out of the system 10 with a transfer module66. Similar to the organic module, also the metallic module includes amask return path 72. Yet further, a carrier supporting the substrateduring processing of the substrate can be returned to the front end ofthe system 10 on a carrier return path 74, typically under atmosphericconditions.

The length 50 of the system 10 is inter alia determined by the number oforganic deposition chambers and the number of metallic depositionchambers, wherein the system architecture for a deposition processhaving a plurality of organic layers below a plurality of metalliclayers in combination with a re-using of a mask for the organic processand a different mask for the metallic process as well as a re-using ofthe carriers result essentially in a linear arrangement. Further, thewidth 90 of the system is inter alia determined by the horizontalsubstrate orientation, the mask return path and the carrier return path.

Considering a tendency towards larger substrate sizes for displaymanufacturing, it is beneficial to provide an improved system andimproved method for depositing an organic layer stack, and particularlyfor depositing an organic layer stack and a metallic layer stack overthe organic layer stack.

SUMMARY

In light of the above, a substrate processing system for processing of aplurality of substrates, a substrate processing system for processing ofa plurality of large area substrates in an essentially verticalorientation, and a method of processing a substrate in an in-linesubstrate processing system are provided. Further aspects, embodiments,features and details can be derived from the dependent claims, thedrawings and the specification.

According to one aspect, a substrate processing system for processing ofa plurality of substrates is provided. The system includes a firstdeposition module being a first in-line module and having a firstplurality of vacuum deposition sources; a second deposition module beinga second in-line module and having a second plurality of vacuumdeposition sources; and a glass handling module between the firstdeposition module and the second deposition module.

According to one aspect, a substrate processing system for processing ofa plurality of large area substrates in an essentially verticalorientation is provided. The system includes at least a first load lockchamber; at least a first vacuum orientation chamber configured to movethe large area substrate between a non-vertical orientation and anon-horizontal orientation; at least a first mask handling moduledownstream from the at least first vacuum orientation chamber; a firstportion of an organic deposition module downstream from the at leastfirst mask handling module; at least a first vacuum rotation moduledownstream from the first portion of the organic deposition module; anda second portion of the organic deposition module downstream from the atleast first vacuum rotation chamber, the at least first mask handlingmodule being downstream from the second portion of the organicdeposition module.

According to one aspect, a method of processing a substrate in anin-line substrate processing system is provided. The method includesmoving the substrate through a first portion of a first depositionmodule being an in-line module from a first end of the first depositionmodule to a second end opposing the first end of the first depositionmodule; rotating the substrate at the second end of the first depositionmodule; moving the substrate along a second portion of the firstdeposition module from the second end of the first deposition module tothe first end of the first deposition module; moving the substratethrough a first portion of a second deposition module being an in-linemodule from a first end of the second deposition module and a secondend, opposing the first end, of the second deposition module; rotatingthe substrate at the second end of the second deposition module; movingthe substrate along a second portion of the second deposition modulefrom the second end of the second deposition module to the first end ofthe second deposition module; and loading the substrate into thesubstrate processing system and unloading the substrate from thesubstrate processing system between the first deposition module and thesecond deposition module.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentdisclosure can be understood in detail, a more particular description ofthe disclosure, briefly summarized above, may be had by reference toembodiments. The accompanying drawings relate to embodiments and aredescribed in the following:

FIG. 1 shows a schematic top view of an industry standard horizontalin-line evaporation system according to the prior art;

FIG. 2 shows a schematic top view of a vertical processing systemaccording to embodiments of the present disclosure;

FIG. 3 shows a schematic top view of a further vertical processingsystem according to embodiments of the present disclosure;

FIG. 4 shows a flowchart illustrating a method to manufacture an organiclayer stack according to embodiments described herein;

FIG. 5 shows a schematic view of a mask handling module for an in-linesubstrate processing system according to embodiments described herein;

FIGS. 6A and 6B show schematic cross-sectional side views of a maskhandling module for an in-line substrate processing system according toembodiments described herein; and

FIGS. 7A and 7B show a flowchart illustrating methods of transporting asubstrate, e.g. a large area substrate in a substrate processing systemaccording to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS

Reference will now be made in detail to the various embodiments, one ormore examples of which are illustrated in the figures. Within thefollowing description of the drawings, the same reference numbers referto same components. Generally, only the differences with respect toindividual embodiments are described. Each example is provided by way ofexplanation and is not meant as a limitation of the disclosure. Further,features illustrated or described as part of one embodiment can be usedon or in conjunction with other embodiments to yield yet a furtherembodiment. It is intended that the description includes suchmodifications and variations.

A process to manufacture OLED displays can include thermal evaporationof organic materials and deposition of organic materials on a substratein a high vacuum. Depending on the display technology, the use of a maskfor patterning the organic layers onto the substrate during depositionmay be provided. For example, a mask may be an edge exclusion maskmasking the parameter of a glass substrate, such as the rectangularglass substrate, e.g. with an edge of a few millimeters. An edgeexclusion mask may be utilized for manufacturing a single color OLEDlayer stack, such as a white layer stack. Other processes may utilize apattern mask, such as a fine metal mask (FFM), wherein the mask providesa pixel pattern for display pixels on the substrate. For example, thismay be used for RGB display manufacturing. Accordingly, OLED displaymanufacturing processes with the utilization of a mask may be complex,for instance, due to additional processes to be accomplished in order totransfer a mask. Further, as particle generation and contamination candeteriorate the OLED display manufacturing system and the resultingdevices, particle generation and contamination is of importance. Similarconsiderations apply for carriers for substrates. In addition to theparticle generation and contamination considerations, i.e. incombination with the particle and contamination considerations, thefootprint of a substrate processing system is beneficially reduced,particularly for display manufacturing on large area substrates.

Embodiments of the present disclosure allow for a strongly reducedfootprint of a substrate processing system for manufacturing an organiclayer stack, and particular for manufacturing an organic layer stack andthe metallic layer stack over the organic layer stack. Further, masksand carriers for a substrate remain under vacuum conditions duringnormal operation.

FIG. 2 shows a vacuum processing system 100. The vacuum processingsystem 100 shown in FIG. 2 includes an organic deposition module 130 anda metallic deposition module 160. The glass handling module 110 isprovided between the organic deposition module 130 and the metallicdeposition module 160. A first mask handling module 120 is providedbetween the glass handling module 110 and the organic deposition module130. A second mask handling module 150 is provided between the glasshandling module 110 and the metallic deposition module 160. Further, afirst rotation module 140 is provided at the organic deposition module130 at an end distal to the first mask handling module 120. A secondrotation module 170 is provided at the metallic deposition module at anend distal to the second mask handling module 150.

In light of the above arrangement, substrates to be processed in thesubstrate processing system 100 are loaded at the glass handling module,for example, on substrate carriers, and are unloaded at the glasshandling module 110, for example from substrate carriers. Accordingly,an empty carrier is provided after unloading of a process substrate atthe same position, at which a new substrate is to be loaded on the emptycarrier. Thus, transportation of empty carriers, for example, on acarrier return path can be avoided or reduced to a minimum. Further,exposure of a carrier to an atmospheric condition can be avoided orreduced to a minimum.

Further, the first rotation module 140 and the second rotation module170 allow for “folding” the organic deposition path and the metallicdeposition path, respectively. As exemplarily described with respect tothe organic deposition module 130, the organic deposition moduleincludes a forward transportation path 131 for depositing a first groupof organic layers on the substrate and a backward transportation path133 for depositing a second group of organic layers over the first groupof organic layers. The substrate is rotated between the forwardtransportation path 131 and the backward transportation path 133 by thefirst rotation module 140. By “folding” the organic deposition path, thelength 124 of the organic deposition module can be reduced, for example,by around 50%.

In combination with the advantage of reducing the length 124 of theorganic deposition module and, thus, reducing the footprint in thelength direction of the substrate processing system 100, a furtheradvantage is provided by the arrangement. The first mask handling module120 is provided at the start of the organic deposition path and (at thesame time) at the end of the organic deposition path. Accordingly, amask that has previously been utilized for a deposition process isremoved from the processed substrate in the first mask handling module120 and can be positioned on a new substrate to be processed in thefirst mask handling module 120. Accordingly, a used mask is providedafter detaching the mask from the substrate at the same position oressentially at the same position, as described below, at which the maskis attached to a substrate. Thus, transportation of mask, for example,on a mask return path can be avoided or reduced to a minimum. Further,exposure of a mask to an atmospheric condition can be avoided or reducedto a minimum.

According to yet further embodiments, which can be combined with otherembodiments described herein, the metallic deposition module includes aforward transportation path 163 for depositing a first group of metalliclayers on the substrate and a backward transportation path 161 fordepositing a second group of metallic layers over the first group ofmetallic layers. The substrate is rotated between the forwardtransportation path and the backward transportation path by the secondrotation module 170. By “folding” the metallic deposition path, thelength 148 of the metallic deposition module can be reduced, forexample, by around 50%.

According to yet further features, details, aspects, and implementationsof embodiments described herein, which can be combined with otherembodiments described herein, the glass handling module 110 includes avacuum orientation module 114 configured to change the substrateorientation from a non-vertical orientation, for example, a horizontalorientation to a non-horizontal orientation, for example, an essentiallyvertical orientation. Accordingly, the substrates can be processedand/or transported through the vacuum processing system 100 in anessentially vertical orientation. Accordingly, the footprint can befurther reduced as compared to an industry standard horizontal in-lineprocessing system. The glass handling module may include a load lockmodule 112. The load lock module 112 is configured to load substrates,for example, large area substrates for display manufacturing from anatmospheric condition into a vacuum and vice versa. For example, thesubstrates may be loaded into and unloaded from the load lock module ina horizontal orientation.

According to embodiments of the present disclosure, a combination of aplurality of advantages can be provided by the system arrangement. Thelength of the substrate processing system can be significantly reduced,for example, by around 50%, wherein the term “around” refers to the factthat one or two additional transfer chambers may be included, forexample, in case of an uneven number of vacuum chambers in a processingpath. The width of the substrate processing system can be significantlyreduced, e.g. by an essentially vertical substrate orientation. Acarrier return path and a mask return path can be avoided, which canparticularly reduce contamination and further reduce the width of thesubstrate processing system.

As exemplarily shown in FIGS. 2 and 3, embodiments of the presentdisclosure include one or more mask handling modules for an in-linesubstrate processing system. For example, the first mask handling module120 can be provided for the organic deposition path. Further, a secondmask handling module 150 can be provided for the metallic depositionpath. The mask handling modules may include similar details, features,and aspects and the first mask handling module 120 is exemplarilydescribed.

The in-line substrate processing system can be a display manufacturingsystem or a part of a display manufacturing system, in particular anOLED display manufacturing system, and more particularly an OLED displaymanufacturing system for large area substrates. The transport of a maskor substrate carrier, i.e. the movement of a substrate carrier throughthe in-line substrate processing system can inter alia be provided in avertically orientated state of the substrate carrier. For example,substrate carriers can be configured to hold a substrate, such as aglass plate, in a vertically orientated state or an essentiallyvertically orientated state.

With exemplary reference to FIGS. 2 and 3, the mask handling module 120may include a vacuum rotation chamber 122. For example, the vacuumrotation chamber can be provided within the in-line substrate processingsystem and is provided between the glass handling module 110 and theorganic deposition module 130. In particular, the vacuum rotationchamber 122 can be configured to provide vacuum conditions in thechamber. Further, the mask handling module 120 may include a rotationmechanism within the vacuum rotation chamber 122. The rotation mechanismmay further include a rotating support. Furthermore, the rotationmechanism may also include an actuator configured to rotate the rotatingsupport within the vacuum rotation chamber 122. Examples of an actuatormay include an electric motor, a pneumatic actuator, an hydraulicactuator, and the like. In particular, the actuator may be configuredfor providing a rotation of at least 120° of the rotating support in aclockwise and/or an anti-clockwise direction. For example, the actuatormay be configured for providing a rotation of 80°.

According to some embodiments, the mask handling module 120 may furtherinclude a first mask stage 324 and a second mask stage 326 (see forexample FIG. 3). The first mask stage and the second mask stage eachinclude a mask holder assembly to support the mask while not attached toa substrate or a substrate carrier, respectively. A first mask holderassembly and/or the second mask holder assembly may include at least oneclamp of the group: an electromagnetic clamp, an electropermanentmagnetic clamp, and a mechanical clamp.

The first mask stage 324 may be mounted to the rotation mechanism forrotation of the first mask stage. Further, the first mask stage may bemounted to the rotation support in a vertical orientation state. Theterm “mounted” refers to the state of being fixed or fastened to therotation mechanism and/or to the rotating support by any fastening meanse.g. through the use of a mechanical holder, an electromagnetic holder,and/or an electropermanent holder. According to yet further embodiments,which can be combined with other embodiments described herein, thesecond mask stage 326 may be provided similar to the first mask stage.

Further, the mask handling module 120 may particularly include at leastone connecting flange configured for connecting at least one vacuumchamber and/or a transit module. Typically, some or all of the differenttypes of connecting flanges have a casing frame-like structure which maybe configured for providing vacuum conditions inside the casingframe-like structure.

According to some embodiments, the mask handling module 120 may alsoinclude a mask handling assembly. The mask handling assembly may bepositioned in a mask handling chamber 123 or a further mask handlingchamber 323 attached to the vacuum rotation chamber. In particular, themask handling chamber or mask handling chambers can be configured toprovide vacuum conditions in the chamber. A mask handling assembly mayinclude a vacuum robot with one, two or more individually movable robothands. Each robot hand may include a mask holding portion configured tograb or support a mask. Further, the mask holding portion may beconfigured to transfer a mask between the vacuum rotation chamber 122and one or more mask holders (e.g. mask shelfs) in the mask handlingchamber 123 or the further mask handling chamber 323. Furthermore, theone or more mask handling chambers can be configured to transfer a maskfrom the rotation mechanism, e.g. from the first mask stage 324 or fromthe second mask stage 326. Furthermore, the one or more mask handlingchambers can be configured to transfer a mask to the rotation mechanism,e.g. to the first mask stage or to the second mask stage.

According to some embodiments, a mask handling assembly in the maskhandling chamber 123 or the mask handling chamber 323 may be configuredfor a first mask transfer between the first mask stage 324 and therespective mask handling chamber. For instance, the mask handlingchamber 123, in particular the mask handling assembly, can be configuredfor loading the mask to the first mask stage. Further, the mask handlingchamber, in particular the mask handling assembly, can be configured toseparate the mask from the first mask stage.

According to some embodiments, the mask handling module 120 may furtherinclude a first substrate transportation track 354 associated with thefirst mask stage 324. The first substrate transportation track may beconfigured to support the first substrate carrier. Accordingly, thefirst mask holder assembly may be configured for a second mask transferbetween the first mask stage 324 and the first substrate carrier. Forinstance, the mask may be loaded or transferred from the first maskstage to the first substrate carrier. Additionally, the mask handlingmodule 120 may also include a second substrate transportation track 356associated with the second mask stage 326. The second substratetransportation track may be configured to support a second substratecarrier.

After deposition of material on a substrate through a mask, the mask maybe carried back to the mask handling module 120, for example, to thefirst mask stage or to the second mask stage by a first substratecarrier or a second substrate carrier, respectively. Thereafter, forexample, a third mask transfer between the second mask stage 326 and themask handling chamber 123 may be conducted. Accordingly, the second maskholder assembly may be configured for a third mask transfer between thesecond mask stage 326 and the mask handling chamber 123. For instance,the mask may be transferred to the mask handling chamber, in particularto the mask handling assembly, e.g. for cleaning.

According to some embodiments, a substrate transportation track can beconfigured for contactless transportation of a substrate carrier. Forexample, the substrate transportation track can be a first substratetransportation track 354 and/or a second substrate transportation track356.

According to some embodiments, which can be combined with otherembodiments described herein, the first mask handling module 120 mayinclude one or more mask handling chambers, for example, mask handlingchamber 123 and mask handling chamber 323. The mask handling chambersare coupled to the vacuum rotation chamber 122. Similarly, the secondmask handling module 150 may include one or more mask handling chambers,for example, mask handling chamber 154 and mask handling chamber 354.The mask handling chambers are coupled to the vacuum rotation chamber152. According to yet further optional modifications, a substratecarrier buffer chamber 129 can be coupled to the vacuum rotation chamber122. Additionally or alternatively, a substrate carrier buffer chamber159 can be coupled to the vacuum rotation chamber 152. Substratecarriers can be loaded from the one or more substrate carrier bufferchambers into the substrate processing system 100, i.e. into one of thedeposition modules, via the one or more vacuum rotation chambers.

According to some embodiments of the present disclosure, a substrateprocessing system 100 is provided wherein the first deposition module,for example, an organic deposition module is provided with a firstportion in one direction and the second portion in an oppositedirection. The vacuum rotation chamber, i.e. the first rotation module140, is provided to move the substrate or a carrier supporting thesubstrate from the first portion to the second portion. Accordingly, thefirst deposition module is “folded”. The mask handling module 120 isprovided at the start of the first deposition module and simultaneouslyat the end of the first deposition module. The mask is unloaded in thevacuum rotation chamber 122. The unloaded mask is loaded on a substrateor a substrate carrier, respectively in the vacuum rotation chamber 122,i.e. the same vacuum rotation chamber. Accordingly, an improved masktransfer is provided and/or a separate mask return path can be avoided.Accordingly, contamination of a mask in the substrate processing system100 can be reduced. The substrate processing system 100 is furtherconfigured to provide the above-mentioned advantages for both an organicdeposition module and the metallic deposition module, i.e. the firstdeposition module and a second deposition module.

Due to the design of the substrate processing system, the substratehandling module or glass handling module 110 is provided close to thestart of the first deposition module and close to the end of the firstdeposition module. Accordingly, an improved substrate carrier transferis provided and/or a substrate carrier return path can be avoided.Accordingly, contamination of the substrate carrier and the substrateprocessing system 100 can be reduced. Yet further, the substratehandling module is provided between a first deposition module and thesecond deposition module. Accordingly, the above-mentioned advantagescan also be utilized for a substrate processing system having a firstdeposition module and the second deposition module, such as an organicdeposition module and a metallic deposition module.

FIG. 3 further illustrates deposition sources in the vacuum chambers ofthe deposition modules. For example, organic deposition sources 372 canbe provided in vacuum chambers of the organic deposition module.According to some embodiments, which can be combined with otherembodiments described herein, the organic deposition sources can beevaporation sources, and particularly line sources extending essentiallyvertically. Organic material can be deposited on a substrate, forexample, while the substrate moves past an organic deposition source 372providing a line source. Yet further, one or more metallic depositionsources 374 and/or one or more metallic deposition sources 376 can beprovided in the metallic deposition module. According to someembodiments, which can be combined with other embodiments describedherein, the metallic deposition sources can be evaporation sources orsputter sources, and particularly can be line sources extendingessentially vertically.

According to some embodiments, which can be combined with otherembodiments described herein, a deposition module, for example, thefirst deposition module or the second deposition module can be providedwith one or more vacuum chambers. The deposition module has a firstportion with a transportation path in one direction and the secondportion with a transportation path in an opposite direction. The firstportion and the second portion can be separated by a separation wall.According to some embodiments, which can be combined with otherembodiments described herein, a deposition module can be provided at onevacuum system, i.e. an arrangement of chambers with or without aseparation wall, therein the vacuum system is evacuated by one or morevacuum pump systems.

FIG. 3 further illustrates a glass handling module 110 according to someembodiments, which can be combined with other embodiments describedherein. The glass handling module 110 includes a first load lock chamber312 and a second load lock chamber 313. The glass handling module 110further includes a first vacuum orientation chamber 314 and a secondvacuum orientation chamber 315. Substrates to be processed in thesubstrate processing system 100 can be loaded at an atmospheric pressureinto one of the load lock chambers. For example, substrates can behorizontally loaded into one of the load lock chambers. After loading,the respective load lock chamber can be evacuated and the substrate canbe transferred in one of the vacuum orientation chambers. In the vacuumorientation chamber, the substrate orientation can be changed from thenon-vertical orientation, for example, the horizontal orientation, tothe non-horizontal orientation, for example, a vertical orientation oran essentially vertical orientation.

According to some embodiments, which can be combined with otherembodiments described herein, at least a first vacuum orientationchamber and a second vacuum orientation chamber can be provided. A loadlock chamber can be provided for each of the vacuum orientationchambers. Providing two or more vacuum orientation chambers has theadvantage of improving the tact time of the substrate processing system100. For example, two or more load lock chambers and correspondingly twoor more vacuum orientation chambers can be operated in a sequence and/oralternatingly. For example, one substrate can be loaded in the firstload lock chamber and a first vacuum orientation chamber while anothersubstrate is transported towards a deposition module from a secondvacuum orientation chamber.

According to an embodiment of the present disclosure, a substrateprocessing system for processing of a plurality of substrates isprovided. The substrate processing system includes a first depositionmodule being a first in-line module and having a first plurality ofvacuum deposition sources and a second deposition module being a secondin-line module and having a second plurality of vacuum depositionsources. A glass handling module is provided between the firstdeposition module and the second deposition module. According to someembodiments, the glass handling module may include a vacuum orientationmodule configured to change a substrate orientation from a non-verticalorientation to a non-horizontal orientation under vacuum. For example,the vacuum orientation module includes a first vacuum orientationchamber and a second vacuum orientation chamber. According to someembodiments, which can be combined with other embodiments describedherein, the glass handling module may further include a load lock modulefor horizontally loading and unloading the glass substrates between anatmospheric region and vacuum in the substrate processing system.

According to some optional modifications of embodiments of the presentdisclosure, the substrate processing system may further include a firstmask handling module between the glass handling module and the firstdeposition module and a second mask handling module between the glasshandling module and the second deposition module. Particularly, at leastone of the first mask handling module and the second mask handlingmodule may provide a vacuum rotation chamber and a mask handling chamberconnected to the vacuum rotation chamber. For example, the vacuumrotation chamber can include a first mask stage and a second mask stage,the vacuum rotation chamber being configured to exchange the positionbetween the first mask stage and the second mask stage.

According to yet further embodiments, which can be combined with otherembodiments described herein, particularly for “folding” the firstdeposition module and the second deposition module and for providing amask handling module for masking and unmasking of a substrate, thesubstrate processing system may include at least one of a first vacuumrotation chamber provided at an end of the first deposition moduledistant to the glass handling module and a second vacuum rotationchamber provided at an end of the second deposition module distant tothe glass handling module.

According to another embodiment, wherein features, details, aspects, andmodifications may be combined with other embodiments described herein, asubstrate processing system for processing a plurality of large areasubstrates in an essentially vertical orientation is provided. Thesubstrate processing system includes at least a first load lock chamber,at least a first vacuum orientation chamber configured to move the largearea substrate between a non-vertical orientation and a non-horizontalorientation, at least a first mask handling module downstream from theat least first vacuum orientation chamber, a first portion of an organicdeposition module downstream from the at least first mask handlingmodule, at least a first vacuum rotation module downstream from thefirst portion of the organic deposition module, and a second portion ofthe organic deposition module downstream from the at least first vacuumrotation chamber, the at least first mask handling module beingdownstream from the second portion of the organic deposition module. Forexample, the substrate processing system may further include a secondmask handling module, wherein the at least first vacuum orientationchamber is provided between the at least first mask handling module andthe second mask handling module, a first portion of metallic depositionmodule downstream from the second mask handling module, a second vacuumrotation module downstream from the first portion of the metallicdeposition module, and a second portion of the metallic depositionmodule downstream from the second vacuum rotation chamber, the secondmask handling module being downstream from the second portion of themetallic deposition module.

FIG. 4 illustrates a method 400of processing a substrate in an in-linesubstrate processing system or a method of manufacturing a display in anin-line substrate processing system. At operation 401, the substrate ismoved through a first portion of a first deposition module being anin-line module from a first end of the first deposition module and asecond end, opposing the first end, of the first deposition module. Thesubstrate is rotated, for example, in the essentially verticalorientation, at the second end of the first deposition module (seeoperation 402). At operation 404, the substrate is moved along a secondportion of the first deposition module from the second end of the firstdeposition module to the first end of the first deposition module.Similar to the movement through the first portion and the second portionof the first deposition module, the substrate can be moved through thefirst portion and a second portion according to operation 406. Forexample, the substrate is moved through a first portion of a seconddeposition module being an in-line module from a first end of the seconddeposition module and a second end, opposing the first end, of thesecond deposition module, is rotated at the second end of the seconddeposition module and is moved along a second portion of the seconddeposition module from the second end of the second deposition module tothe first end of the second deposition module. At operation 408, thesubstrate is loaded into the substrate processing system and is unloadedfrom the substrate processing system between the first deposition moduleand the second deposition module. It is to be understood, that thesubstrate is loaded into the substrate processing system before movingthe substrate in the first deposition module and the second depositionmodule and that the substrate is unloaded after moving the substrate inthe first deposition module and the second deposition module. Forexample, the substrate may be moved through the substrate handlingmodule from the first deposition module to the second deposition module,e.g. after processing in the first deposition module and beforeprocessing in the second deposition module.

According to some embodiments, which can be combined with otherembodiments described herein, the substrate orientation is changedbetween a non-vertical orientation and a non-horizontal orientation. Thevacuum orientation chamber for changing the substrate orientation isprovided between the first deposition module and the second depositionmodule in the substrate handling module. Additionally or alternatively,a method of processing a substrate and/or manufacturing a display mayinclude masking the substrate in a position between the first depositionmodule and the second deposition module in a mask handling module andunmasking the substrate in a position between the first depositionmodule and the second deposition module in the mask handling module. Forexample, the mask can be rotated after unmasking the substrate in themask handling module to mask a further substrate. The rotated mask canbe used to mask a further substrate. Accordingly, embodiments of thepresent disclosure provide the advantage to avoid a mask return pathand, thus, to reduce the footprint of a substrate processing system.

According to embodiments of the present disclosure, the masking conceptproviding unmasking and masking in the same mask handling module can beprovided for the first deposition module, for example, an organicdeposition module and the second deposition module, for example, ametallic deposition module. Accordingly, for manufacturing of one ormore organic displays, an organic deposition path and a metallicdeposition path each provide a mask handling module according toembodiments of the present disclosure. Accordingly, different masks fororganic deposition and metallic deposition can be provided. For both theorganic deposition and the metallic deposition, the advantageous maskingconcept can be provided for embodiments described herein.

Embodiments of the present disclosure may refer to substratetransportation in a substrate processing system. According toembodiments of the present disclosure, a substrate can be processed inan essentially vertical orientation. Further, the substrate can besupported by a carrier and the carrier supporting the substrate can betransferred within the substrate processing system. For example, acarrier can be an electrostatic chuck configured to support large areasubstrates. Additionally or alternatively, the carrier can be configuredto be levitated by a transportation system. Levitation refers tocontactless or essentially contactless transportation of the carrier,for example, with magnetic levitation system.

According to some embodiments, which can be combined with otherembodiments described herein, the substrate carriers can be configuredfor holding or supporting the substrate or the substrate and the mask ina substantially vertical orientation. Further, a mask stage can beconfigured for holding or supporting the mask in a substantiallyvertical orientation. As used throughout the present disclosure,“substantially vertical” is understood particularly when referring tothe substrate orientation, to allow for a deviation from the verticaldirection or orientation of ±20° or below, e.g. of ±10° or below. Thisdeviation can be provided for example because a substrate support withsome deviation from the vertical orientation might result in a morestable substrate position. Further, fewer particles reach the substratesurface when the substrate is tilted forward. Yet, the substrateorientation, e.g., during the deposition of materials, such as organicor metallic materials, on a substrate in a high vacuum, is consideredsubstantially vertical, which is considered different from thehorizontal substrate orientation, which may be considered as horizontal±20° or below.

According to some embodiments, which can be combined with otherembodiments described herein, a substrate carrier can be anelectrostatic chuck (E-chuck) providing an electrostatic force forholding the substrate and optionally the mask at the substrate carrier,and particularly at the support surface. For example, the substratecarrier includes an electrode arrangement configured to provide anattracting force acting on the substrate.

The embodiments described herein can be utilized for deposition ofmaterials, such as organic or metallic materials, on large areasubstrates, e.g., for OLED display manufacturing. Specifically, thesubstrates, for which the structures and methods according toembodiments described herein are provided, may be large area substrates.For instance, a large area substrate can be GEN 4.5, which correspondsto a surface area of about 0.67 m² (0.73 m×0.92 m), GEN 5, whichcorresponds to a surface area of about 1.4 m² (1.1 m×1.3 m), GEN 7.5,which corresponds to a surface area of about 4.29 m² (1.95 m×2.2 m), GEN8.5, which corresponds to a surface area of about 5.7 m² (2.2 m×2.5 m),or even GEN 10, which corresponds to a surface area of about 8.7 m²(2.85 m×3.05 m). Even larger generations such as GEN 11 and GEN 12 andcorresponding surface areas can similarly be implemented. Half sizes ofthe GEN generations may also be provided in OLED display manufacturing.

According to some embodiments, which can be combined with otherembodiments described herein, the substrate thickness can be from 0.1 to1.8 mm. The substrate thickness can be about 0.9 mm or below, such as0.5 mm. The term “substrate” as used herein may particularly embracesubstantially inflexible substrates, e.g., a glass plate or othersubstrates. However, the present disclosure is not limited thereto andthe term “substrate” may also embrace flexible substrates such as a webor a foil. The term “substantially inflexible” is understood todistinguish over “flexible”. Specifically, a substantially inflexiblesubstrate can have a certain degree of flexibility, e.g. a glass platehaving a thickness of 0.9 mm or below, such as 0.5 mm or below, whereinthe flexibility of the substantially inflexible substrate is small incomparison to the flexible substrates.

The contactless transportation may be a magnetic levitation system. Inparticular, the magnetic levitation system may be provided so that atleast a part of the weight of a substrate carrier is carried by themagnetic levitation system. The substrate carriers can then be guidedessentially contactlessly along a first substrate transportation trackand/or a second substrate transportation track, respectively, throughthe in-line substrate processing system. In particular, the firstsubstrate transportation track and the second substrate transportationtrack may each include a carrier holding structure and carrier drivingstructure. A carrier holding structure can be configured for acontactless holding of a substrate carrier. A carrier driving structurecan be configured for a contactless translation of a substrate carrier,for example, a first substrate carrier or the second substrate carrier.A carrier holding structure may include a magnetic levitation system forcontactless holding of a substrate carrier. Further, a carrier drivingstructure may include a magnetic drive system for contactless driving ofa substrate carrier.

FIG. 5 shows a vacuum orientation chamber 314. The vacuum orientationchamber can be a vacuum orientation chamber of the vacuum orientationmodule 120 shown in FIG. 2.

The vacuum orientation chamber includes a vacuum chamber 502. The vacuumchamber 502 includes side walls. The side wall 502A and the side wall502B (not visible in FIG. 5) oppose each other. Further, side wall 502Cis provided between the two opposing side walls. The vacuum orientationchamber is configured to change the substrate orientation betweennon-vertical orientation, for example, a horizontal orientation and anon-horizontal orientation, for example, a vertical orientation oressentially vertical orientation. An exemplary orientation actuator isshown in FIG. 6B.

The vacuum orientation module or a vacuum orientation chamber of thevacuum orientation module participates in transportation of a substratein a substrate processing system. A substrate can be loaded into thevacuum orientation chamber or unloaded from the vacuum orientationchamber as indicated by arrow 513. For example, the substrate can beloaded from a load lock chamber or loaded into a load lock chamber alongarrow 513. Loading and unloading is conducted in a non-verticalorientation, for example, a horizontal orientation. A slit opening 512,such as a horizontal slit opening, is provided in the further side wall502C of the vacuum chamber 502.

According to some embodiments, which can be combined with otherembodiments described herein, the substrate may enter the vacuum chamber502 at the first slit opening 514. For example, the slit opening 514 canbe provided at the side wall 502A. The substrate can exit the vacuumchamber 502 at the side wall 502B. According to some embodiments, whichcan be combined with other embodiments described herein, moving asubstrate into the vacuum chamber 502 and out of the vacuum chamber canbe conducted on opposing sides of the vacuum chamber, i.e. opposing sidewalls. A transportation track (not shown in FIG. 5) is provided betweenthe two slit openings at opposing side walls of the vacuum chamber. Themovement of the substrate is indicated by arrows 515. For embodiments ofthe present disclosure, a substrate can be transported on a substratecarrier according to embodiments described herein.

According to embodiments of the present disclosure, the two slitopenings at the opposing side walls are vertical or essentiallyvertical. A substrate can be transported through the vacuum chamber 502along the bidirectional transportation direction in an essentiallyvertical orientation. Vacuum swing modules according to the state of theart typically have a horizontal slit opening at one side of the vacuumswing module and have a vertical slit opening at an opposing side of thevacuum swing module. Accordingly, a substrate can be horizontally loadedin a portrait orientation with a robot or the like. The substrate isrotated along the substrate's longer side, i.e. the length of thesubstrate, and is transported out of the vacuum swing module in avertical orientation and with a landscape orientation.

Embodiments of the present disclosure provide a horizontal loading ofthe substrate in a landscape orientation, for example, through slitopening 512 at the side wall 502C, i.e. the side wall between the twoopposing side walls. The horizontal loading in a landscape orientationis counter-intuitive and would generally need to be avoided. However,the benefits with respect to mask handling, the footprint of substrateprocessing system, and tact time motivate a deviation from thehorizontal portrait handling.

According to one embodiment of the present disclosure, a vacuumorientation module for a substrate processing system is provided. Thevacuum orientation module includes at least a first vacuum orientationchamber, e.g. vacuum orientation chamber 314 shown in FIG. 5 and in FIG.3. The vacuum orientation chamber 315 shown in FIG. 3 can be providedsimilar to the vacuum orientation chamber 314. The vacuum orientationchamber includes a vacuum chamber and a transportation track within thevacuum chamber, the transportation track having a support structure anda driving structure and defines a bi-directional transportationdirection. An orientation actuator is provided to change the substrateorientation between a non-vertical orientation and a non-horizontalorientation. According to some embodiments of the present disclosure,the vacuum chamber has a two slit openings at opposing side walls of thevacuum chamber in the bi-directional direction. For example, the twoslit openings may include the first slit opening 514 and the furtherslit opening not shown in FIG. 5. The opposing side walls can be sidewall 502A and side wall 502B.

According to some embodiments, a non-vertical slit opening, for example,horizontal slit opening 512 shown in FIG. 5 can be provided for the atleast first vacuum orientation chamber. The slit opening 512 can beprovided for loading and unloading of the substrates. According to yetfurther embodiments, which can be combined with other embodimentsdescribed herein, a second vacuum orientation chamber can be provided ina substrate processing system, as illustrated in FIG. 3. The secondvacuum orientation chamber is aligned with the at least firstorientation chamber along the in-line direction of the substrateprocessing system. Particularly, one or vertical slit openings of thesecond vacuum orientation chamber and the at least first vacuumorientation chamber can be aligned.

According to some embodiments, which can be combined with otherembodiments described herein, slit openings in the vacuum chamber of thevacuum orientation chamber according to embodiments described herein canbe provided with the slit valve. The slit valve can be provided to sealthe vacuum chamber in a vacuum tight manner. Particularly the horizontalslit opening 512 can be provided with a slit valve. According to yetfurther optional embodiments, also the slit opening 514 and/or the slitopening opposing the slit opening 514 can be provided with a slit valve.

According to an embodiment, the vacuum orientation module is provided.The vacuum orientation module includes at least a first vacuumorientation chamber. The at least first vacuum orientation chamberincludes a vacuum chamber and a transportation track within the vacuumchamber, the transportation track having a support structure and adriving structure. Further, an orientation actuator to change thesubstrate orientation between a non-vertical orientation and anon-horizontal orientation is provided. The orientation actuator movesthe substrate by an angle and around an axis located between a first endof the substrate and a second end of the substrate, wherein the secondend opposes the first end.

For example, FIGS. 6A and 6B illustrate a vacuum orientation chamberhaving a vacuum chamber 502. A slit opening 512 is provided at a sidewall 502C of the vacuum chamber 502. A substrate 650 can be loaded ontoa carrier 652 through the slit opening 512. The carrier 652 can be asubstrate carrier according to embodiments described herein. Forexample, the carrier can be an electrostatic chuck. After loading thesubstrate 650 on the carrier 652 in the non-vertical orientation, forexample, a horizontal orientation shown in FIG. 6A, the substrate can bemoved as indicated by arrow 651. The substrate is moved, for example,from the horizontal orientation in a vertical orientation or anessentially vertical orientation and towards a transportation track fortransporting of the substrate or the carrier having the substrate,respectively.

According to some embodiments, which can be combined with otherembodiments described herein, the transportation track can be providedby a magnetic levitation system. For example, the support structure 612can be provided above the carrier 652 and driving structure 614 can beprovided below the carrier 652. The support structure 612 can be amagnetic bearing having, for example, one or more electromagnets tolevitate the carrier 652.

The driving structure 614 can be a magnetic drive having, for example,one or more electromagnets to drive the carrier 652 along atransportation direction. For example, the carrier can be moved asindicated by arrows 515 shown in FIG. 5.

The movement of the carrier from the horizontal orientation to theessentially vertical orientation can be provided by an orientationactuator, for example, orientation actuator 660 shown in FIG. 6B. Asexemplarily indicated by arrow 651 in FIG. 6A, the orientation actuatoris configured to move the substrate away from the transportation trackin the non-vertical orientation, i.e. the horizontal orientation.Accordingly, when supporting the carrier 652 in the horizontalorientation, the space between the support structure 612 and the drivingstructure 614 is empty. Another carrier with another substrate can movethrough the vacuum chamber 502 as exemplarily indicated by arrows 515 inFIG. 5 while a carrier 652 is in a horizontal orientation in the vacuumchamber 502. According to some embodiments, which can be combined withother embodiments described herein, the transportation track can beavailable for a second carrier while having a first carrier in thenon-vertical (horizontal) orientation. Accordingly, a vacuum orientationchamber according to embodiments of the present disclosure allows tohave at least two substrates in the vacuum chamber 502. Particularly,the first substrate can be supported in a horizontal orientation and asecond substrate can be supported between a first support structure 612and the first driving structure 614. Embodiments of vacuum orientationchambers, according to embodiments described herein, allow forincreasing the tact time in a substrate processing system by providingtwo or more vacuum orientation chambers in a vacuum orientation module.

As for example shown in FIG. 3, the first vacuum orientation chamber 314can be provided and a second vacuum orientation chamber 315 can beprovided. Moving of substrates between non-vertical and non-horizontalorientations can be provided, for example, alternatingly in the twovacuum orientation chambers. An essentially vertically orientedsubstrate can be moved from the first vacuum orientation chamber 314through the second vacuum orientation chamber 315 towards the firstdeposition module. Simultaneously, a further substrate can be loaded ona further carrier in the second vacuum orientation chamber 315. In lightof the fact that the orientation actuator in the vacuum chamber providesan empty transportation track between the support structure 612 and thedriving structure 614 while substrates are loaded horizontally on acarrier, the substrate moving from the first vacuum orientation chambers314 towards the first deposition module can utilize the emptytransportation track. Such a movement is schematically illustrated byarrows 515 in FIG. 5. A vacuum orientation module according toembodiments described herein advantageously allows for increasing thetact time. For example, having two vacuum orientation chambers operatingsimultaneously, the tact time can be essentially doubled.

FIG. 6B illustrates yet further details of an orientation actuator 660according to embodiments of the present disclosure. An orientationactuator 660 includes a support 672 for supporting a carrier 652. Thecarrier includes a first end 653 and a second end 655 opposing the firstend 653. The support 672 is configured to support the carrier 652between the first end 653 and the second end 655. Particularly, thesupport 672 can be configured to support the carrier at or close to thecenter of the carrier, i.e. the center between the first end 653 and thesecond end 655. According to some embodiments, which can be combinedwith other embodiments described herein, an orientation actuator isconfigured to change the substrate orientation between a non-verticalorientation and a non-horizontal orientation, the orientation actuatormoving the substrate by an angle and around an axis located between afirst end of the substrate and a second end of the substrate, the secondend opposing the first end.

Supporting the carrier at or proximate to the center allows for amovement of the carrier away from the transportation track while movingthe carrier from the essentially vertical orientation in the horizontalorientation.

According to some embodiments, which can be combined with otherembodiments described herein, the movement of the carrier between thetwo orientations can include a movement by an angle and a translation asindicated by the arrow in FIG. 6B.

FIGS. 7A and 7B illustrate embodiments of methods of transporting alarge area substrate having a length and a width shorter than the lengthin a substrate processing system or a corresponding method ofmanufacturing a layer stack of a display and including thetransportation methods. A method can include loading the large areasubstrate into a vacuum orientation chamber in a non-verticalorientation with a movement parallel to the width of the large areasubstrate, as indicated by operation 701 (see FIG. 7A). Accordingly, thesubstrate is horizontally loaded at a landscape orientation. Atoperation 703, the large area substrate is moved from the non-verticalorientation of the substrate to a non-horizontal orientation, e.g. withan orientation actuator provided in the vacuum chamber.

Additionally or alternatively, a method includes operation 702, i.e.moving the large area substrate into at least a first vacuum orientationchamber having a vacuum chamber through a first slit opening at a firstside wall of the vacuum chamber. For example, this may be theessentially vertical slit opening 514 shown in FIG. 5. At operation 704,the large area substrate is moved out of the at least first vacuumorientation chamber through a second slit opening at the second sidewall of the vacuum chamber, the second side will oppose the first sidewall. For example, this may be a slit opening at side wall 502B (notvisible in FIG. 5). Further, at operation 706, the large area substrateis moved from a non-vertical orientation of the substrate to anon-horizontal orientation or vice versa in the at least first vacuumorientation chamber.

According to yet further embodiments, a method of manufacturing a layerstack for display on a large area substrate may include one or more ofthe transportation methods described above and may further includedepositing one or more layers of a layer stack for display. For example,layers can be deposited in a first deposition module, for example, anorganic deposition module. Additionally or alternatively, layers can bedeposited in a second deposition module, for example, the metallicdeposition module.

Yet further embodiments of vacuum orientation module for a substrateprocessing system can be described with respect to FIGS. 2, 3, 5, 6A,and 6B. As described above, a substrate may be loaded in the substrateprocessing system 100 through a load lock module 112. The substrate canbe moved in the vacuum orientation module in a horizontal orientation.According to some embodiments, which can be combined with otherembodiments described herein, the substrate can be loaded on a substratecarrier in a horizontal orientation. Further, the carrier supporting thesubstrate can be moved by an angle to change the substrate orientationfrom a horizontal orientation to a non-horizontal orientation.Thereafter, the substrate can be moved to a mask handling module 120 anda first deposition module 130. After deposition in the first depositionmodule 130, for example, an organic deposition module, a mask that haspreviously been provided at the substrate in the mask handling modulecan be removed in the mask handling module. A carrier supporting thesubstrate is moved through the glass handling module 110 towards thesecond deposition module 160. For example, the carrier supporting thesubstrate can be moved in the second mask handling module 150, a maskcan be provided at the substrate, and a deposition process can beprovided in the second deposition module, for example, the metallicdeposition module. After processing in the second deposition module 160,the mask can be removed in the mask handling module 150. The substrateorientation can be changed from the non-horizontal orientation, i.e. anessentially vertical orientation, to a horizontal orientation in avacuum orientation chamber and can be unloaded from the substrateprocessing system 100 through the load lock module. According to someembodiments, which can be combined with other embodiments describedherein, the number of load lock chambers in the load lock module 112 cancorrespond to the number of vacuum orientation chambers in a vacuumorientation module 114.

As described above, a transfer from the first deposition module 130 tothe second deposition module 160 include a transfer through the glasshandling module 110. Accordingly, a vacuum orientation module for asubstrate processing system includes at least a first vacuum orientationchamber. The at least first orientation chamber includes a vacuumchamber and a first transportation track within the vacuum chamber, thefirst transportation track having a first support structure and a firstdriving structure defining a bi-directional transportation direction.The first support structure can be a support structure 612 shown in FIG.6A and the first driving structure can be driving structure 614 shown inFIG. 6A. An orientation actuator 660 can be provided. According to someembodiments, an orientation actuator is configured to change thesubstrate orientation between a non-vertical orientation and anon-horizontal orientation, the vacuum chamber has a first pair of twoslit openings at opposing side walls of the vacuum chamber in thebi-directional direction. According to some embodiments of the presentdisclosure, which can be combined with other embodiments describedherein, a second transportation track within the vacuum chamber isprovided. The second transportation track includes a second supportstructure and a second driving structure extending along thebi-directional transportation direction. The vacuum chamber has a secondpair of two slit openings at the opposing side walls of the vacuumchamber.

The second transportation track can be provided by the second supportstructures 622 and the second driving structure 624 shown in FIG. 6A.Vertical slit openings can be provided in opposing side walls of thevacuum chamber 502 for transportation along the second transportationtrack. For example, FIG. 5A shows slit opening 524 at side wall 502A. Asecond slit opening corresponding to slit opening 524 can be provided atside wall 502B. Accordingly, a carrier supporting the substrate can bemoved through the vacuum chamber 502 as indicated by arrows 525 in FIG.5. The carrier supporting the substrate can be moved with the seconddrive structure 624 while being supported by the second supportstructure 622.

According to some embodiments, which can be combined with otherembodiments described herein, the second transportation track ispositioned, such that the first transportation track having firstsupport structure 612 and first driving structure 614 is providedbetween the slit opening 512 and the second transportation track. Asshown in FIG. 6B, according to some embodiments, which can be combinedwith other embodiments described herein, the first transportation trackand the second transportation track can be separated by a separationwall 632. The separation wall 632 can provide separation between thefirst region of the vacuum chamber 502 and the second region of thevacuum chamber 502. Accordingly, the separation wall 632 may separatetwo vacuum regions that are pumped individually, for example, with twovacuum pump systems. Alternatively, the two regions may be evacuated bya common vacuum pump system. Irrespective of the presence of aseparation wall, a horizontal distance between the first transportationtrack and the second transportation track can be, for example, 20 cm orabove and/or can be 100 cm or below. For example, a distance between thetransportation tracks can be about 50 cm.

According to some embodiments, which can be combined with otherembodiments described herein, a second vacuum orientation chamber can bealigned with the first vacuum orientation chamber, such that the secondslit opening 524 at side wall 502A is aligned with the further slitopening at side wall 502B. In light of the above, a substrate processingsystem can be provided. The substrate processing system includes a firstdeposition module being a first in-line module and having a firstplurality of vacuum deposition sources and a second deposition modulebeing a second in-line module and having a second plurality of vacuumdeposition sources. The substrate processing system further includes aglass handling module between the first deposition module and the seconddeposition module, the glass handling module comprises a vacuumorientation module according to any of the embodiments described herein.Particularly, the vacuum orientation module may have a secondtransportation track. According to yet further additional or alternativemodifications, the vacuum deposition module may include a first vacuumorientation chamber and a second vacuum orientation chamber, each havinga second transportation track.

In light of the above, one or more of the following advantages can beprovided by embodiments of the present disclosure. The mask handling canbe improved. Particularly a mask return path can be avoided. Furthermask transport can be provided in the vacuum processing system to avoidcontamination of a mask or a mask carrier. Further, substrate carriertransport can also be provided, with the exception of replacement orcleaning, in the vacuum processing system to avoid contamination of asubstrate carrier. The footprint of the substrate processing system canbe reduced by folding of the deposition modules and avoiding returnpaths for mask and/or substrate carriers. Embodiments allow for havingtwo or more vacuum orientation chambers working simultaneously in thevacuum processing system to increase the tact time of the vacuumprocessing system. Further, a separation of an organic deposition moduleand a metallic deposition module can be provided to allow for individualmasking for the different deposition modules. Yet further, the abovedescribed advantages, which apply to one deposition module, can beprovided for both deposition modules.

While the foregoing is directed to some embodiments, other and furtherembodiments may be devised without departing from the basic scope, andthe scope is determined by the claims that follow.

1. A substrate processing system for processing of a plurality ofsubstrates, comprising: a first deposition module being a first in-linemodule and having a first plurality of vacuum deposition sources; asecond deposition module being a second in-line module and having asecond plurality of vacuum deposition sources; and a glass handlingmodule between the first deposition module and the second depositionmodule.
 2. The substrate processing system according to claim 1, whereinthe glass handling module comprises: a vacuum orientation moduleconfigured to change a substrate orientation from a non-verticalorientation to a non-horizontal orientation under vacuum.
 3. Thesubstrate processing system according to claim 2, wherein the vacuumorientation module comprises: a first vacuum orientation chamber; and asecond vacuum orientation chamber.
 4. The substrate processing systemaccording to claim 1, wherein the glass handling module furthercomprises: a load lock module for horizontally loading and unloading theglass substrates between an atmospheric region and vacuum in thesubstrate processing system.
 5. The substrate processing systemaccording to claim 1, further comprising at least one of: a first maskhandling module between the glass handling module and the firstdeposition module; and a second mask handling module between the glasshandling module and the second deposition module.
 6. The substrateprocessing system according to claim 5, wherein at least one of thefirst mask handling module and the second mask handling modulecomprises: a vacuum rotation chamber; and a mask handling chamberconnected to the vacuum rotation chamber.
 7. The substrate processingsystem according to claim 6, wherein the vacuum rotation chambercomprises: a first mask stage and a second mask stage, the vacuumrotation chamber being configured to exchange the position between thefirst mask stage and the second mask stage.
 8. The substrate processingsystem according to claim 1, further comprising at least one of: a firstvacuum rotation chamber provided at an end of the first depositionmodule distant to the glass handling module; and a second vacuumrotation chamber provided at an end of the second deposition moduledistant to the glass handling module.
 9. A substrate processing systemfor processing of a plurality of large area substrates in an essentiallyvertical orientation, comprising: at least a first load lock chamber; atleast a first vacuum orientation chamber configured to move the largearea substrate between a non-vertical orientation and a non-horizontalorientation; at least a first mask handling module downstream from theat least first vacuum orientation chamber; a first portion of an organicdeposition module downstream from the at least first mask handlingmodule; at least a first vacuum rotation module downstream from thefirst portion of the organic deposition module; and a second portion ofthe organic deposition module downstream from the at least first vacuumrotation chamber, the at least first mask handling module beingdownstream from the second portion of the organic deposition module. 10.The substrate processing system according to claim 9, furthercomprising: a second mask handling module, wherein the at least firstvacuum orientation chamber is provided between the at least first maskhandling module and the second mask handling module; a first portion ofmetallic deposition module downstream from the second mask handlingmodule; a second vacuum rotation module downstream from the firstportion of the metallic deposition module; and a second portion of themetallic deposition module downstream from the second vacuum rotationchamber, the second mask handling module being downstream from thesecond portion of the metallic deposition module.
 11. A method ofprocessing a substrate in an in-line substrate processing system,comprising: moving the substrate through a first portion of a firstdeposition module being an in-line module from a first end of the firstdeposition module to a second end opposing the first end of the firstdeposition module; rotating the substrate at the second end of the firstdeposition module; moving the substrate along a second portion of thefirst deposition module from the second end of the first depositionmodule to the first end of the first deposition module; moving thesubstrate through a first portion of a second deposition module being anin-line module from a first end of the second deposition module and asecond end, opposing the first end, of the second deposition module;rotating the substrate at the second end of the second depositionmodule; moving the substrate along a second portion of the seconddeposition module from the second end of the second deposition module tothe first end of the second deposition module; and loading the substrateinto the substrate processing system and unloading the substrate fromthe substrate processing system between the first deposition module andthe second deposition module.
 12. The method according to claim 11,further comprising: changing the substrate orientation between anon-vertical orientation and a non-horizontal orientation in a positionbetween the first deposition module and the second deposition module ina substrate handling module.
 13. The method according to claim 12,further comprising: moving the substrate through the substrate handlingmodule from the first deposition module to the second deposition module.14. The method according to claim 11, further comprising: masking thesubstrate between the first deposition module and the second depositionmodule in a mask handling module; and unmasking the substrate betweenthe first deposition module and the second deposition module in the maskhandling module.
 15. The method according to claim 14, furthercomprising: rotating a mask after unmasking the substrate in the maskhandling module to mask a further substrate.